Micron to Build $9.6B HBM Chip Facility at Hiroshima Campus

Micron Technology has announced plans to invest approximately $9.6 billion to establish a high-bandwidth memory (HBM) production facility at its Hiroshima campus in Japan. The project is intended to increase Micron’s capacity for advanced memory products used in data centers, AI accelerators and high-performance computing platforms. HBM, with its stacked-die architecture and wide memory interfaces, is a key component for GPUs and AI chips that demand exceptional throughput and energy efficiency.

The Hiroshima site will accommodate fabrication and assembly operations, strengthening Micron’s manufacturing presence in Asia and helping diversify global memory supply chains. In announcing the plan, Micron pointed to rising demand for HBM driven by generative AI, machine learning workloads and cloud infrastructure, though the company has not yet released a detailed timeline for construction or production start-up.

Analysts say the investment is a strategic response to both market opportunity and supply-chain considerations, as chipmakers seek to secure capacity amid geopolitical uncertainties. Japan’s ecosystem — including materials suppliers, precision manufacturing partners, and experienced engineers — is well positioned to support the complex packaging and testing stages required for HBM modules. The build-out is expected to bring local hiring and collaboration with regional suppliers.

Market observers will be watching for capital expenditure breakdowns, any government incentives, and how additional HBM capacity might affect pricing and availability. HBM occupies a premium segment in the memory market thanks to its performance and power advantages; expanding output could ease shortages and support broader adoption in next-generation AI servers, edge devices and specialized accelerators.

Micron’s announcement aligns with a broader industry trend of onshoring and regional diversification among major semiconductor firms responding to surging AI workloads and supply-chain risk management. Further announcements could include employment estimates, projected annual output, and specifics on technology transfer or local supplier investment. Stakeholders will monitor forthcoming updates for timing, output targets and potential regulatory or partnership details.